Call for Papers
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2017 IEEE High Performance Extreme Computing Conference (HPEC ‘17) Twenty-first Annual HPEC Conference 12 - 14 September 2017 Westin Hotel, Waltham, MA USA
Call for Papers 2017 Submission Deadline: May 19, 2017
The IEEE High Performance Extreme Computing Conference (HPEC ’17) will be held in the Greater Boston Area, Massachusetts, USA on 12 - 14 September 2017. The HPEC charter is to be the premier conference in the world on the confluence of HPC and Embedded Computing. The technical committee seeks new presentations that clearly describe advances in high performance extreme computing technologies, emphasizing one or more of the following topics: Advanced Multicore Software Technologies Case Studies and Benchmarking of Applications Automated Design Tools Mapping and Scheduling o Parallel and Real-Time Applications Computing Technologies for Challenging Form Factors ASIC and FPGA Advances Open System Architectures Data Intensive Computing Big Data and Distributed Computing Interactive and Real-Time Supercomputing Graph Analytics and Network Science Fault-Tolerant Computing Embedded Cloud Computing Digital Front Ends General Purpose GPU Computing Advanced Processor Architectures Secure Computing & Anti-Tamper Technologies New Application Frontiers High Performance Data Analysis Cloud HPEC Big Data Meets Big Compute Important Dates: 19 May 2017: Paper submission deadline 16 June 2017: Author notification of acceptance HPEC accepts two types of submissions: 1. Full papers (up to 6 pages, references not included), and 2. Extended abstracts (up to 2 pages, references included). Preference will be given to papers with strong, quantitative results, demonstrating novel approaches or describing high quality prototypes. Authors of full papers can mark their preference for a poster display or an oral presentation. Presenters who wish to have hardware demonstrations are encouraged to mark their preference for a poster display. Accepted extended abstracts will be displayed as posters. All paper and extended abstract submissions need to use the approved IEEE templates. Full paper submissions with the highest peer review ratings will be published by IEEE in the official HPEC proceedings available on IEEE eXplore. All other accepted submissions and extended abstracts are published on ieee-hpec.org. Vendors are encouraged to sign up for vendor booths. This will allow vendors to present their HPEC technologies in an interactive atmosphere suitable for product demonstration and promotion. We welcome input (hpec@ieee-hpec.org) on tutorials, invited talks, special sessions, peer reviewed presentations, and vendor demos. Instructions for submitting will be posted on the conference web site shortly. Full paper submissions should use the approved IEEE templates. The highest scoring submissions will be published by IEEE in the official HPEC proceedings available on IEEE eXplore. All other accepted submissions are published on ieee-hpec.org.